Job Summary
A company is looking for a Senior Packaging Technical Engineer - Hardware.
Key Responsibilities
- Define the chip pad ring, substrate interconnect scheme, and lead the package layout design process
- Collaborate with various engineering teams including Circuit, Signal Integrity, and System Design
- Define chip floor plans, pad rings, substrates, and implement robust electrical packages
Required Qualifications
- BSEE or equivalent experience
- Minimum of 8+ years in board/system design, with package design experience preferred
- Good understanding of transmission line theory, power delivery, and signal integrity
- Strong programming and scripting skills in Perl, Python, Tcl; familiarity with Cadence Skill and Excel is helpful
- Ability to work independently and solve complex technical problems
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